Wafer Level System Integration at Fraunhofer IZM

With its application-driven research, Fraunhofer Institute for Microintegration and Reliability (IZM) bridges the gap between microelectronic component providers and technical system manufacturers in a broad range of industries, including automotive, medical and consumer electronics sectors. 

The Wafer Level System Integration (WLSI) department focuses on the development and application of thin film processes for microelectronic packaging. Its well-established wafer level pilot line can be utilized for prototyping and small volume production. The list of WLSI’s in-house capabilities include (but it’s not limited) to: wafer level bumping, wafer level CSP and redistribution, 2.5D / 3D integration, flip-chip assembly and MEMS integration. In this webinar we will address two WLSI topics in detail: 

o                2.5/3D Integration and advanced bumping technologies and

o                Cryo-packaging for quantum applications

Violeta Prodanović obtained MSc degree in electrical engineering at the University of Belgrade in 2013. In 2019, she received Doctoral degree at Delft University of Technology, after conducting research on MEMS-fabricated membranes for electron multiplication in a single photon counter. In her following career steps she gained experience in process development of various MEMS-based and graphene devices, and later on in the field of physical failure analysis of packaged ICs. In 2024, she joined Fraunhofer IZM’s business development team for Wafer Level System Integration department.

Hermann Oppermann received the Doctoral degree in Materials Science at the Metals Research Institute of the Technical University Berlin. Since 1993 he has been with the Microperipheric Center of the TU Berlin, and was working in flip chip and CSP packaging technology. In 1999 he moved to the Fraunhofer IZM where he leads the group Fine Pitch Assembly and Interconnects. There he contributes to the field of flip chip, die attach and wafer level packaging for MEMS, RF, opto- and power applications. He was driving the development in AuSn soldering in die bond and flip chip applications, transient liquid phase bonding and nanometal bonding. In 2024 he was awarded with the German Future Prize – the German Federal President’s Prize for Technology and Innovation – for Digital Light.

Morten Brink received the diploma degree (M.Sc.) in chemistry from the Technical University Berlin, Germany, in 2012. Since 2013, he has been working at the Fraunhofer Institute for Reliability and Microintegration in Berlin, Germany. He is a scientist in the “Bumping and Metallization” group. His research topics are related to micro-bumping processes in pitch ranges of 50µm and below. He works as R&D engineer and project manager in the field of advanced wafer-level packaging solutions with focus on pixel detectors, sensor packaging applications, as well as special bumping technologies for areas such as quantum computing, µLEDs and infrared sensors.