This workshop will provide sessions on photonic integration, photonic packaging and live demo photonic alignment and testing. Participants will get the chance to use test equipment and optical alignment stages to align fibre to the photonic Integration Circuit (PIC) chips. Participants will also learn how to extract useful parameters using test equipment from Santec after they attend sessions on how to perform the testing. Many devices will be tested, including Mach-Zehnder Interferometer (MZI), ring resonators, DWDM and CWDM devices. The sessions will provide comprehensive optical packaging solutions, including photonic wire bonding, edge couplers, and grating couplers. There will be sessions on die attach, electrical wire bonding and considerations when designing high-speed packaging solutions. Topics will include:
- Photonic Heterogeneous integration
- Optical alignment, PIC-fiber interfaces, including edge couplers, grating couplers and Photonic Wire bonding
- Die attach, electrical wire bonding, flip chip integration and packaging considerations
- Packaging solutions for high-speed applications
- Photonic test demonstrations on fiber-PIC alignment, transmission and back reflection measurements
Photonics North 2025
The workshop will be integrated with the Photonics North 2025 conference and held at the same location. We worked closely with PN2025 organizers to avoid any conflict with the main conference technical sessions.
You can plan your accommodation based on the Photonics North 2025 program.
Local participants who are not attending Photonics North, please contact ahmed.abumazwed@cmc.ca to arrange registration to attend the workshop sessions only. However, we recommend that participants register to the conference as we plan to select a couple of technical sessions from the conference program to attend as a group. Attending these extra sessions are not directly related to the content of the workshop, but they will highlight the importance of design for packaging in various applications.
Target Audience
Photonic Design Engineers who work on many photonic platforms, including silicon photonics, thin-film lithium niobate, and any other photonic integrated platform. Mechanical engineers, microelectronics engineers, and microwave engineers who would like to learn more about PIC packaging and testing to improve their skills in working with other departments in the company.
Pre-Requisites
There is no prerequisite to attend this workshop. Attendees with a basic knowledge of any PIC design will benefit from this workshop to learn design for testing and design for packaging skills.
Schedule
| Date | Time | Location |
| May 21, 2025 | 8:00 am to 9:30 am | Rogers Centre, Ottawa, ON Same venue of Photonics North 2025 |
| May 21, 2025 | 6:00 pm to 8:00pm | |
| May 22, 2025 | 6:30pm to 8:30pm |
