Awarded Projects.
Market-ready semiconductor innovation.
The 21st century’s critical technologies
Semiconductors are ubiquitous. The 21st century’s most advanced technologies rely on semiconductors. They control power and communication systems, connecting and operating everything from refrigerators and cellphones to cars, pacemakers, satellites. They enable complex sensing, performance, data storage, retrieval, add functionality, improve energy efficiency and reduce cost. The competitiveness of every industry the Canadian economy relies on – from agriculture and natural resources to advanced manufacturing and automotives – depends to some degree on semiconductor technology.
FABrIC’s mandate is to accelerate the development of semiconductor products and develop semiconductor manufacturing capability domestically.
The goal is to increase Canadian-built solutions in the semiconductor supply chain to enhance the resilience of Canadian industry and increase the economic footprint of the semiconductor industry in Canada.
Canada’s place in the world’s largest and most complicated supply chain
The semiconductor supply chain is one of the world’s largest and most complicated. It draws on highly specialized materials, components, manufacturing equipment, expertise and processes to design, fabricate, assemble, package, and test finished chips.
That supply chain includes globally recognized names like TSMC, Samsung and Intel, whose fabs and foundries produce hundreds of millions of CMOS chips annually. But it also includes a growing demand for niche technologies where Canada has significant strengths. Our expertise in photonics, MEMS, compound semiconductors and quantum technology gives Canada the opportunity to be a significant player in the global supply chain.
FABrIC’s role is to stimulate and accelerate those opportunities. And now, we’d like to introduce you to our May 2026 cohort:
Accelerating Canada’s Semiconductor Industry
2025-26 Funding by province
- Expressions of Interest
- Total Investments
BC
18
AB
21
SK
1
MB
2
ON
104
QC
75
NB
1
NS
4
PE
-
NL
5
Total Expressions of Interest by Province
| Project Lead | Province | City | Type | Year | Project |
|---|---|---|---|---|---|
| Blumind Inc. | ON | Ottawa | Product Development | 2026 | Ultra Low Power Analog AI for Physical AI, Platform for IoT and Wearables |
| Bonsai Micro | BC | Vancouver | Product Development | 2026 | Edge AI Controller (eAIC) for LEO Satcom and 5G |
| Boréas Technologies Inc. | QC | Bromont | Product Development | 2026 | Active Cooling for Edge AI Computing |
| HaiLa Technologies Inc. | QC | Montréal | Product Development | 2026 | Ultra-Low-Power Edge-AI Connectivity Chip |
| indie Photonics Canada Inc. | QC | Québec City | Product Development | 2026 | Semiconductor Lasers for Oceanic Fibre Optic Sensing |
| mmSense Technologies Inc. | ON | Waterloo | Product Development | 2026 | High Performance connected conformal 4D millimetre wave Radar IoT Sensor |
| Noze Inc. | QC | Saint-Laurent | Product Development | 2026 | Development of high-resolution, scalable silicon aroma sensor for healthcare applications |
| Ranovus Inc. | ON | Ottawa | Product Development | 2026 | ODIN® Optical Engine Fast-track Prototype Development (“Raptor”) |
| Sheba Microsystems Inc. | ON | Toronto | Product Development | 2026 | MEMS-actuators for AI-based temperature compensation enabling enhanced ADAS camera systems |
| SPARK Microsystems | QC | Montréal | Product Development | 2026 | Wireless Personal Area Network System-in-Package for Low-Energy, Low-Latency AI Wearables |
| WhalePiX | QC | Québec City | Product Development | 2026 | LightEdge: Scalable Photonic Chiplets for Far-Reach Connectivity |
| Axonal | QC | Montréal | Product Development | 2025 | paraDOX™: (parallel Digital Optical Cross (X) Connect) A new Ethernet Packet Switch Architecture using Silicon Photonic Optical Logic |
| Teledyne MEMS | QC | Bromont | Product Development | 2025 | Cu-TSV platform development |
| Soundskrit | QC | Montréal | Product Development | 2025 | Development of a directional MEMS microphone resilient to wind noise for outdoor consumer devices |
| Ranovus | ON | Kanata | Product Development | 2025 | ODIN® ELS-Canada Capability Demonstrator (ELS-CCD) |
| Qubic | QC | Sherbrooke | Product Development | 2025 | Development and commercialization of low-noise superconducting amplifiers for scalable quantum computing |
| Quantum Recon | BC | Vancouver | Process Development | 2025 | Quantum I/O: Fabricating next generation photonic circuits to unlock scalable quantum computing |
| PROVA Innovations | ON | Ancaster | Product Development | 2025 | Advanced ASIC Development for Real-Time Gait Analysis in Rehabilitation Devices |
| Omniply | QC | Montréal | Process Development | 2025 | Next Generation III-V Semiconductor Wafer Platform for Large-Format Integrated Photonics |
| MMSENSE Technologies | ON | Waterloo | Product Development | 2025 | High Efficiency Beamforming IC and Intelligent Beam-forming Antenna Modules for Satellite IoT and ESA Terminals |
| Micro-°K | QC | Montréal | Process Development | 2025 | New fabrication processes for advanced MEMS thermal sensors |
| INO | QC | Quebec City | Process Development | 2025 | Establishing a Canadian TFLN integrated circuit prototyping and fabrication capacity |
| Jones Microwave | AB | Edmonton | Process Development | 2025 | Commercial Scale-Up of High-Frequency, High-Power, and High-Speed Light-Activated Solid-State Plasma Switches |
| ICSPI | ON | Waterloo | Product Development | 2025 | Development of an atomic force microscope semiconductor metrology system |
| Edgewater Wireless | ON | Kanata | Product Development | 2025 | Delivering next-generation Spectrum Slicing for IoT and Wi-Fi applications |
| Dream Photonics | BC | Vancouver | Process Development | 2025 | LINC3D – Laser-Integrated Nanophotonic Chiplets using 3D Printing, Fabrication Process Development |
| DIGITHO | QC | Bromont | Product Development | 2025 | Reprogrammable photomask for direct writing capability in lithography for Semiconductors |
| C2MI | QC | Sherbrooke | Process Development | 2025 | Next generation packaging: Die to Wafer (D2W) Heterogeneous Direct Bonding |
| Boréas Technologies | QC | Bromont | Product Development | 2025 | Force and location sensor with piezo haptic driver integrated on a single die using a single piezo transducer to perform all functions |
| Anyon Systems | QC | Quebec City | Process Development | 2025 | Low Volume Prototyping and Testing of 3D Quantum Chips |
| AEPONYX | QC | Montréal | Process Development | 2025 | Development of an advanced integrated photonic platform targeted for operation between 450 and 1065 nm for quantum applications |