Awarded Projects.
Market-ready semiconductor innovation.

The 21st century’s critical technologies

Semiconductors are ubiquitous. The 21st century’s most advanced technologies rely on semiconductors. They control power and communication systems, connecting and operating everything from refrigerators and cellphones to cars, pacemakers, satellites. They enable complex sensing, performance, data storage, retrieval, add functionality, improve energy efficiency and reduce cost. The competitiveness of every industry the Canadian economy relies on – from agriculture and natural resources to advanced manufacturing and automotives – depends to some degree on semiconductor technology.

FABrIC’s mandate is to accelerate the development of semiconductor products and develop semiconductor manufacturing capability domestically.

The goal is to increase Canadian-built solutions in the semiconductor supply chain to enhance the resilience of Canadian industry and increase the economic footprint of the semiconductor industry in Canada.

Canada’s place in the world’s largest and most complicated supply chain

The semiconductor supply chain is one of the world’s largest and most complicated. It draws on highly specialized materials, components, manufacturing equipment, expertise and processes to design, fabricate, assemble, package, and test finished chips.

That supply chain includes globally recognized names like TSMC, Samsung and Intel, whose fabs and foundries produce hundreds of millions of CMOS chips annually. But it also includes a growing demand for niche technologies where Canada has significant strengths.  Our expertise in photonics, MEMS, compound semiconductors and quantum technology gives Canada the opportunity to be a significant player in the global supply chain.

FABrIC’s role is to stimulate and accelerate those opportunities. And now, we’d like to introduce you to our first cohort.

Accelerating Canada’s Semiconductor Industry
2025 Funding by province
  • Expressions of Interest
  • Investments 2025
2

British Columbia
Dream Photonics
Quantum Recon

1

Alberta
Jones Microwave

5

Ontario
Edgewater Wireless
ICSPI
mmSense
PROVA Innovations
Ranovus

12

Quebec

Twenty-three recipients representing twenty projects of the first round of FABrIC Challenge Projects were announced in June 2025.  Leveraging $35.6M in total investment, the $13.4M in funding provided by Innovation, Science and Economic Development Canada (ISED), calls on the semiconductor industry to innovate in product and process development to enhance the resilience of the supply chain for Canadian industry, from healthcare to the automotive sector. Managed by CMC Microsystems, FABrIC is a five-year, $223 million initiative to secure Canada’s future in semiconductors. Read full press release.

Fabrication Process Challenge Recipients

AEPONYX
Development of an advanced integrated photonic platform targeted for operation between 450 and 1065 nm for quantum applications
QC
Round 1
Anyon Systems
Co-Lead

C2MI

Low Volume Prototyping and Testing of 3D Quantum Chips
QC
Round 1
C2MI
Co-Lead

3iT

Next generation packaging: Die to Wafer (D2W) Heterogeneous Direct Bonding
QC
Round 1
Dream Photonics
LINC3D – Laser-Integrated Nanophotonic Chiplets using 3D Printing, Fabrication Process Development
BC
Round 1
INO
Co-Lead

EXFO

C2MI

Aeponyx

Establishing a Canadian TFLN integrated circuit prototyping and fabrication capacity
QC
Round 1
Jones Microwave
Commercial Scale-Up of High-Frequency, High-Power, and High-Speed Light-Activated Solid-State Plasma Switches
AB
Round 1
Micro-°K
New fabrication processes for advanced MEMS thermal sensors
QC
Round 1
Omniply
Next Generation III-V Semiconductor Wafer Platform for Large-Format Integrated Photonics
QC
Round 1
Quantum Recon
Quantum I/O: Fabricating next generation photonic circuits to unlock scalable quantum computing
BC
Round 1
Teledyne MEMS
Cu-TSV platform development
QC
Round 1

Product Development Challenge Recipients

Axonal
paraDOX™: (parallel Digital Optical Cross (X) Connect) A new Ethernet Packet Switch Architecture using Silicon Photonic Optical Logic 
QC
Round 1
Boréas Technologies
Force and location sensor with piezo haptic driver integrated on a single die using a single piezo transducer to perform all functions
QC
Round 1
DIGITHO
Reprogrammable photomask for direct writing capability in lithography for Semiconductors
QC
Round 1
Edgewater Wireless
Delivering next-generation Spectrum Slicing for IoT and Wi-Fi applications
ON
Round 1
ICSPI
Development of an atomic force microscope semiconductor metrology system
ON
Round 1
MMSENSE Technologies
Co-Lead

C-COM Satellite Systems

High Efficiency Beamforming IC and Intelligent Beam-forming Antenna Modules for Satellite IoT and ESA Terminals
ON
Round 1
PROVA Innovations
Advanced ASIC Development for Real-Time Gait Analysis in Rehabilitation Devices
ON
Round 1
Qubic
Development and commercialization of low-noise superconducting amplifiers for scalable quantum computing
QC
Round 1
Ranovus
ODIN® ELS-Canada Capability Demonstrator (ELS-CCD)
ON
Round 1
Soundskrit
Development of a directional MEMS microphone resilient to wind noise for outdoor consumer devices
QC
Round 1
Project LeadLocationCityTypeAward DateProject
AxonalQCMontréalProduct DevelopmentJune 2025paraDOX™: (parallel Digital Optical Cross (X) Connect) A new Ethernet Packet Switch Architecture using Silicon Photonic Optical Logic 
Teledyne MEMSQCBromontProduct DevelopmentJune 2025Cu-TSV platform development
SoundskritQCMontréalProduct DevelopmentJune 2025Development of a directional MEMS microphone resilient to wind noise for outdoor consumer devices
RanovusONKanataProduct DevelopmentJune 2025ODIN® ELS-Canada Capability Demonstrator (ELS-CCD)
QubicQCSherbrookeProduct DevelopmentJune 2025Development and commercialization of low-noise superconducting amplifiers for scalable quantum computing
Quantum ReconBCVancouverProcess DevelopmentJune 2025Quantum I/O: Fabricating next generation photonic circuits to unlock scalable quantum computing
PROVA InnovationsONAncasterProduct DevelopmentJune 2025Advanced ASIC Development for Real-Time Gait Analysis in Rehabilitation Devices
OmniplyQCMontréalProcess DevelopmentJune 2025Next Generation III-V Semiconductor Wafer Platform for Large-Format Integrated Photonics
MMSENSE TechnologiesONWaterlooProduct DevelopmentJune 2025High Efficiency Beamforming IC and Intelligent Beam-forming Antenna Modules for Satellite IoT and ESA Terminals
Micro-°KQCMontréalProcess DevelopmentJune 2025New fabrication processes for advanced MEMS thermal sensors
INOQCQuebec CityProcess DevelopmentJune 2025Establishing a Canadian TFLN integrated circuit prototyping and fabrication capacity
Jones MicrowaveABEdmontonProcess DevelopmentJune 2025Commercial Scale-Up of High-Frequency, High-Power, and High-Speed Light-Activated Solid-State Plasma Switches
ICSPIONWaterlooProduct DevelopmentJune 2025Development of an atomic force microscope semiconductor metrology system
Edgewater WirelessONKanataProduct DevelopmentJune 2025Delivering next-generation Spectrum Slicing for IoT and Wi-Fi applications
Dream PhotonicsBCVancouverProcess DevelopmentJune 2025LINC3D – Laser-Integrated Nanophotonic Chiplets using 3D Printing, Fabrication Process Development
DIGITHOQCBromontProduct DevelopmentJune 2025Reprogrammable photomask for direct writing capability in lithography for Semiconductors
C2MIQCSherbrookeProcess DevelopmentJune 2025Next generation packaging: Die to Wafer (D2W) Heterogeneous Direct Bonding
Boréas TechnologiesQCBromontProduct DevelopmentJune 2025Force and location sensor with piezo haptic driver integrated on a single die using a single piezo transducer to perform all functions
Anyon SystemsQCQuebec CityProcess DevelopmentJune 2025Low Volume Prototyping and Testing of 3D Quantum Chips
AEPONYXQCMontréalProcess DevelopmentJune 2025Development of an advanced integrated photonic platform targeted for operation between 450 and 1065 nm for quantum applications
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