Funded projects.
Market-ready semiconductor innovation.
The 21st century’s critical technologies
Semiconductors are ubiquitous. The 21st century’s most advanced technologies rely on semiconductors. They control power and communication systems, connecting and operating everything from refrigerators and cellphones to cars, pacemakers, satellites. They enable complex sensing, performance, data storage, retrieval, add functionality, improve energy efficiency and reduce cost. The competitiveness of every industry the Canadian economy relies on – from agriculture and natural resources to advanced manufacturing and automotives – depends to some degree on semiconductor technology.
FABrIC’s mandate is to accelerate the development of semiconductor products and develop semiconductor manufacturing capability domestically.
The goal is to increase Canadian-built solutions in the semiconductor supply chain to enhance the resilience of Canadian industry and increase the economic footprint of the semiconductor industry in Canada.
Canada’s place in the world’s largest and most complicated supply chain
The semiconductor supply chain is one of the world’s largest and most complicated. It draws on highly specialized materials, components, manufacturing equipment, expertise and processes to design, fabricate, assemble, package, and test finished chips.
That supply chain includes globally recognized names like TSMC, Samsung and Intel, whose fabs and foundries produce hundreds of millions of CMOS chips annually. But it also includes a growing demand for niche technologies where Canada has significant strengths. Our expertise in photonics, MEMS, compound semiconductors and quantum technology gives Canada the opportunity to be a significant player in the global supply chain.
FABrIC’s role is to stimulate and accelerate those opportunities. And now, we’d like to introduce you to our first cohort.
2025 Funding by province
- Expressions of Interest
- Investments 2025
Fabrication Process Challenge Recipients
AEPONYX
Development of an advanced integrated photonic platform targeted for operation between 450 and 1065 nm for quantum applications
Quebec, Montréal
Round 1
Anyon Systems
Co-Lead
C2MI
Low Volume Prototyping and Testing of 3D Quantum Chips
Quebec, Quebec City
Round 1
C2MI
Co-Lead
3iT
Next generation packaging: Die to Wafer (D2W) Heterogeneous Direct Bonding
Quebec, Sherbrooke
Round 1
Dream Photonics
LINC3D – Laser-Integrated Nanophotonic Chiplets using 3D Printing, Fabrication Process Development
British Columbia, Vancouver
Round 1
INO
Co-Lead
EXFO
C2MI
Aeponyx
Establishing a Canadian TFLN integrated circuit prototyping and fabrication capacity
Quebec, Quebec City
Round 1
Jones Microwave
Commercial Scale-Up of High-Frequency, High-Power, and High-Speed Light-Activated Solid-State Plasma Switches
Alberta, Edmonton
Round 1
Micro-°K
New fabrication processes for advanced MEMS thermal sensors
Quebec, Montréal
Round 1
Omniply
Next Generation III-V Semiconductor Wafer Platform for Large-Format Integrated Photonics
Quebec, Montréal
Round 1
Quantum Recon
Quantum I/O: Fabricating next generation photonic circuits to unlock scalable quantum computing
British Columbia, Vancouver
Round 1
Teledyne MEMS
Cu-TSV platform development
Quebec
Round 1
Product Development Challenge Recipients
Axonal
paraDOX™: (parallel Digital Optical Cross (X) Connect) A new Ethernet Packet Switch Architecture using Silicon Photonic Optical Logic
Quebec, Montréal
Round 1
Boréas Technologies
Force and location sensor with piezo haptic driver integrated on a single die using a single piezo transducer to perform all functions
Quebec, Bromont
Round 1
DIGITHO
Reprogrammable photomask for direct writing capability in lithography for Semiconductors
Quebec, Bromont
Round 1
Edgewater Wireless
Delivering next-generation Spectrum Slicing for IoT and Wi-Fi applications
Ontario, Kanata
Round 1
ICSPI
Development of an atomic force microscope semiconductor metrology system
Ontario, Waterloo
Round 1
MMSENSE Technologies
Co-Lead
C-COM Satellite Systems
High Efficiency Beamforming IC and Intelligent Beam-forming Antenna Modules for Satellite IoT and ESA Terminals
Ontario, Waterloo
Round 1
PROVA Innovations
Advanced ASIC Development for Real-Time Gait Analysis in Rehabilitation Devices
Ontario, Ancaster
Round 1
Qubic
Development and commercialization of low-noise superconducting amplifiers for scalable quantum computing
Quebec, Sherbrooke
Round 1
Ranovus
ODIN® ELS-Canada Capability Demonstrator (ELS-CCD)
Ontario, Kanata
Round 1
Soundskrit
Development of a directional MEMS microphone resilient to wind noise for outdoor consumer devices
Quebec, Montréal
Round 1
| Project Lead | Location | Type |
|---|---|---|
| Axonal | Quebec, Montréal | Product Development |
| Teledyne MEMS | Quebec | Product Development |
| Soundskrit | Quebec, Montréal | Product Development |
| Ranovus | Ontario, Kanata | Product Development |
| Qubic | Quebec, Sherbrooke | Product Development |
| Quantum Recon | British Columbia, Vancouver | Process Development |
| PROVA Innovations | Ontario, Ancaster | Product Development |
| Omniply | Quebec, Montréal | Process Development |
| MMSENSE Technologies | Ontario, Waterloo | Product Development |
| Micro-°K | Quebec, Montréal | Process Development |
| INO | Quebec, Quebec City | Process Development |
| Jones Microwave | Alberta, Edmonton | Process Development |
| ICSPI | Ontario, Waterloo | Product Development |
| Edgewater Wireless | Ontario, Kanata | Product Development |
| Dream Photonics | British Columbia, Vancouver | Process Development |
| DIGITHO | Quebec, Bromont | Product Development |
| C2MI | Quebec, Sherbrooke | Process Development |
| Boréas Technologies | Quebec, Bromont | Product Development |
| Anyon Systems | Quebec, Quebec City | Process Development |
| AEPONYX | Quebec, Montréal | Process Development |
