C2MI

Next generation packaging: Die to Wafer (D2W) Heterogeneous Direct Bonding

Project

This project will develop a series of process steps to achieve direct bonding of various material pairs, a critical enabler for many advanced packaging applications. Specifically, backside grinding, polishing, dicing, cleaning, plasma surface activation and bonding technologies will be investigated. Appropriate characterization activities will assess both pre-bond surface quality (atomic force microscopy-AFM) and bond integrity (shear/tensile strength testing, ultrasonic void inspection and SEM bond interface inspection). At the end of the project, a die-to-wafer direct bonding process flow, tunable to specific material pairs, will enable Canadian entities to prototype and validate product innovations using leading-edge packaging.

Infrastructure in the manufacturing fields of microelectromechanical systems (MEMS), advanced assembly of semiconductors, MEMS, compound semiconductors and electronic systems, as well as printable electronics, C2MI is at the heart of all industrial activity sectors, integrating components essential to the use and deployment of digital technologies.

Co-Lead

About 3IT

3IT is a research center for industry-university synergy in technological innovation. Innovation cannot take place in isolation. For that reason, 3IT provides academic and industrial partners with an outstanding ecosystem for collaborative research, involving cutting-edge technological capabilities and wide scientific expertise.

At 3IT, world-renowned researchers, university and graduate students, research professionals, technicians and interdisciplinary support staff combine their expertise with a common goal: to create high-impact technological solutions.

High impact means having a positive influence on the world. Therefore 3IT works with local and international industrialists who are visionary, pragmatic and committed to advancing applied science from theory to practice.

Project Metrics

C2MI

3iT

Next generation packaging: Die to Wafer (D2W) Heterogeneous Direct Bonding

Targeted Industry/ies:

Digital Technologies & Telecommunications

Process Development

Round 1

Quebec, Sherbrooke

$119,000

For more information on this project: