LINC3D – Laser-Integrated Nanophotonic Chiplets using 3D Printing, Fabrication Process Development
LINC3D – Laser-Integrated Nanophotonic Chiplets using 3D Printing, Fabrication Process Development
Project
The growing demand for AI clusters, driven by massive data processing, requires high-speed, energy-efficient interconnects. Optical chiplets enable ultra-fast data transfer with low power consumption, but challenges in laser integration and optical packaging are bottlenecks. Addressing precision in optical coupling, thermal management, and alignment is crucial to unlocking the full potential of optical chiplets, enabling faster, low-latency communication and scalability in AI systems. This project aims to develop a scalable solution for fibre and laser optical packaging of silicon photonic integrated circuits (PICs) through the development of a wafer-scale advanced packaging process that utilises 3D-printed optical components.
"In order for datacenters to meet the demands of AI the photonic integration bottleneck must be solved. Today, 80% of the cost in building a silicon photonic transceiver (an integral component for the AI solution) is in packaging, test, and assembly. This has hamstrung the growth of the silicon photonic industry, across all applications, and must be solved in order for silicon photonics to have a significant impact. This project aims to solve this bottleneck, by offering a high performance, scalable optical integration method to the semiconductor sector. "
— Dream Photonics
Dream Photonics
Dream Photonics is a semiconductor company, providing licensable IP and optical integration solutions that enable photonic technologies to scale by solving the integration bottleneck. We enable our customers to build their photonic products with applications in data communications, computing (AI, Quantum), LiDAR, sensing, and microwave photonic industries.
Dream Photonics offers a diverse portfolio of multi-foundry IP building blocks that foundries and end-customers license and integrate into their chip design, with a focus on optical interfaces to chips. Dream Photonics offers the industry’s most flexible assembly solutions, enabling customers to integrate lasers, optical amplifiers, fibers, and other optical components.
Project Metrics
"The main and immediate target for this project is the data communications market in the ICT sector. The secondary longer-term market is quantum communications and computing - which also demand a solution for reliable, low-loss packaging of photonic components. Tertiary applications include LiDAR, sensing, and microwave photonic industries as well."
— Dream Photonics
Dream Photonics
LINC3D – Laser-Integrated Nanophotonic Chiplets using 3D Printing, Fabrication Process Development
Targeted Industry/ies:
Advanced Manufacturing, Digital Technologies & Telecommunications
Process Development
Round 1
British Columbia, Vancouver
$322,000
