HaiLa Technologies Inc.

Ultra-Low-Power Edge-AI Connectivity Chip

Project

Wireless IoT devices rely on batteries that need frequent replacement — a cost and logistical burden that limits how widely they can be deployed. Sending raw sensor data to the cloud adds latency, raises privacy concerns, and contributes to growing data centre energy consumption. HaiLa is building the BSC3500, an ultra-low-power edge-AI connectivity chip that processes sensor data locally and transmits only low-bandwidth, AI-derived results over an extremely low-energy wireless link — enabling smarter, longer-lasting devices for smart buildings, industrial monitoring, automotive, and consumer wearables. The result: IoT devices that can run for years on a single battery while keeping data private and reducing cloud dependence. Developed entirely in Canada, the BSC3500 keeps world-class semiconductor IP and high-value engineering talent at home.

Building Canadian capacity

This project will deliver a reusable innovation platform by producing evaluation kits, reference designs, and documentation that can be adapted by Canadian SMEs. By prioritizing domestic partners and keeping IP in Canada, it strengthens the country’s supply chain and creates high-value semiconductor design jobs.

HaiLa’s participation in IEEE 802.11bb ambient energy standardization positions Canadian IP as a key contributor to emerging international standards.

"The IoT market has reached an inflection point — devices need to be smarter, not just connected. HaiLa has developed ultra-low-power wireless technology that consumes just a few microwatts, and the BSC3500 represents the next leap forward: on-chip AI that processes data locally, safeguards privacy, and dramatically extends battery life. With FABrIC's support, we can accelerate the delivery of this chip and establish Canadian IP at the foundation of next-generation intelligent IoT."
— Patricia Bower, VP, Product Management, HaiLa Technologies Inc.
HaiLa Technologies Inc.

HaiLa is a fabless semiconductor and software company developing low-power multi-protocol radio communication for IoT devices. Originally conceptualized at Stanford University, HaiLa enables pervasive edge AI and the scaling of battery-free IoT by offering extremely power-efficient wireless connectivity on industry-standard wireless protocols like Wi-Fi, Bluetooth, and cellular. HaiLa solutions deliver unparalleled cost savings in battery maintenance, the ability to leverage existing wireless infrastructure, and support for efficient communication of locally inferenced AI/ML data directly on the device.

Project Metrics

HaiLa Technologies Inc.

Project

Ultra-Low-Power Edge-AI Connectivity Chip

Targeted Industry/ies

Agri-tech, Automotive, Clean Tech and Energy, Digital Technologies, Medtech

Electrified / Connected Vehicles, Clean Tech / Energy, Agri-Food, Healthcare / Biotech, Digital Technologies (AI, 5/6G Data, etc.), Consumer electronics

Type

Product Development

Awarded

May 2026

Location

Montréal

QC

Funding

$1,000,000

For more information on this project:

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