In this project, we will revolutionize the fabrication of III-V semiconductor devices, pushing Canada to the forefront of the next era of digital communications and consumer electronics. Currently, high-quality III-V materials need to be grown on small, expensive substrates like GaN, sapphire, and SiC, which can lead to challenges in integrating fabricated devices into conventional manufacturing lines. We will eliminate the need for these costly wafers and fabrication processes, not only simplifying manufacturing but also accelerating the adoption of III-V devices in industries like displays, silicon photonics, and clean energy, enabled by our patented OmniChip substrate platform, incorporating next-gen delamination and near-zero-strain layers.