Cu-TSV platform development
Cu-TSV platform development
Project
Copper Through-Silicon Vias (Cu-TSVs) are an enabler for 3D integration, allowing vertical stacking of chips to achieve higher performance, reduced form factor, and improved thermal and electrical efficiency. They are critical for advanced applications such as AI, HPC, IoT, and medical imaging, where high bandwidth and compact integration are essential. While Cu-TSV technology is available for 300mm wafer production, it has not been commercially accessible for 200mm wafers—limiting adoption in markets that rely on legacy or specialized processes. Existing 200mm solutions in Europe, use metal vias that are not compatible with CMOS integration or true 3D stacking. The proposed via-last process on thick, self-supported 300–400 µm wafers addresses this gap by enabling Cu-TSVs without the need for carrier wafers. This approach supports integration with thin sensors or MEMS, improves mechanical stability, reduces thermal stress through partial Cu filling, and maintains high electrical performance—offering a scalable, North America-based solution for next-generation heterogeneous integration.
"Copper Through-Silicon Vias (Cu-TSVs) are an enabler for 3D integration, allowing vertical stacking of chips to achieve higher performance, reduced form factor, and improved thermal and electrical efficiency. They are critical for advanced applications such as AI, HPC, IoT, and medical imaging, where high bandwidth and compact integration are essential. This project will strengthen Canada’s semiconductor industry by helping smart technologies work better together, combining sensors and chips to build more intelligent systems for the future."
— Sebastien Michel, Teledyne MEMS Vice-President and General Manager
Teledyne MEMS
Teledyne MEMS is part of the Teledyne Imaging Group and is an industry-leading pure-play MEMS foundry, specializing in manufacturing MEMS and microfabrication solutions, from initial prototypes to high-volume production.
With two Canadian manufacturing locations, Teledyne MEMS is a key provider of devices for diverse markets including micro-mirrors for telecommunications, gyro sensors for game controllers, microfluidic devices for miniaturized medical systems, and inertial sensors for automobiles
Teledyne MEMS is committed to maintaining stringent quality systems, delivering exceptional service, and safeguarding customer intellectual property. Backed by decades of expertise, Teledyne’s innovative MEMS solutions are engineered to enhance performance while minimizing size and power consumption.
Project Metrics
"The development of such technology (Cu-TSV) typically takes many years to bring it to a reliable and mature state with design access material, ready to accept customers. The FABrIC funding from CMC Microsystem is essential to allow Teledyne to invest the technical resources required to make it happen within a two year timeframe to bridge quickly the gap between R&D status and first customers revenues."
— Sebastien Michel, Teledyne MEMS Vice-President and General Manager
Teledyne MEMS
Cu-TSV platform development
Targeted Industry/ies:
Advanced Manufacturing
Product Development
Round 1
Bromont
Quebec
$409,000