Cu-TSV platform development
Cu-TSV platform development
Project
Development of Cu-TSV technology for 3D integration of MEMS and image sensors, and facilitate packaging and system integration. The main project milestones are: 1. temporary carrier bonding & wafer thinning, 2. IR alignment and DRIE of TSV and landing on CMOS pads 3. Cu barrier, seed layer deposition & RDL layer definition 4. UBM plating and carrier debonding or removal. Phases 5&6 will deal with the industrialization & the qualification of the process, where we will establish a consistent process flow with process window characterization and control plan. Electrical performances of Cu-TSV and RDL will be evaluated. Standard GDS cells will be documented to facilitate access by the CMC community. A PDK will be developed.
Teledyne MEMS
Building on a strong base of leading-edge customers across all markets, Teledyne provides experience-based solutions for semiconductor development, prototyping, and volume manufacturing to high-growth markets. Teledyne MEMS is part of the Teledyne Imaging Group and is one of the world’s leading developers and manufacturers of MEMS and micro-fabricated products. Teledyne Micralyne is a key provider of MEMS sensors and other microstructures that differentiate exciting applications such as IoT devices, medical technologies and optical communications.
Project Metrics
Teledyne MEMS
Cu-TSV platform development
Targeted Industry/ies:
Advanced Manufacturing
Product Development
Round 1
Quebec, Bromont
$409,000
