This 6-hour workshop consists of three 2-hour sessions covering photonic integration and packaging. It includes a live demo on photonic alignment/packaging and testing, where participants will use test equipment to test packaged photonic Integration Circuit (PIC) chips and extract parameters with Santec equipment. The workshop will test devices such as DWDM, and CWDM devices and ring resonators. Additionally, it addresses optical packaging solutions like edge couplers, grating couplers, and heterogenous techniques such as Micro-Tranfer Printing (MTP), other packaging topics will be covered, such as die attach, electrical wire bonding, package design considerations, and high-speed packaging design considerations.
Photonics North 2025
The workshop will be integrated with the Photonics North 2025 conference and held at the same location.
You can plan your accommodation based on the Photonics North 2025 program.
Local participants who are not attending Photonics North, please contact ahmed.abumazwed@cmc.ca to arrange registration to attend the workshop sessions only.
Target Audience
Photonic Design Engineers who work on many photonic platforms, including silicon photonics, thin-film lithium niobate, and any other photonic integrated platform. Mechanical engineers, microelectronics engineers, and microwave engineers who would like to learn more about PIC packaging and testing to improve their skills in working with other departments in the company.
Pre-Requisites
There is no prerequisite to attend this workshop. Attendees with a basic knowledge of any PIC design will benefit from this workshop to learn design for testing and design for packaging skills.
Schedule
| Date | Topics | Presenter | Time | Location |
| May 21 2025 | Introduction | Ahmed Abumazwed CMC Microsystems | 8:00-8:15am | Rogers Centre Meeting room 102 Level 1 |
| Photonic Packaging: optical connections, electrical connections, Die attach, Reliability Testing, Packaging Design | Bruno Fisette INO | 8:15-9:00am | ||
| Optical Connectors for CPO (Topic TBC) | Alexandre Janta-Polczynski | 9:15-10:00am | ||
| May 21 2025 | Moving Photonics Interconnects deeper into CMOS: Opportunities and challenges of existing technologies to mee the escalating demand for BW and Energy density requirements in HPC | Amr Helmy University of Toronto | 6:00-6:45pm | Rogers Centre Gatineau Salon Level 2 |
| Heterogeneous Integration via Micro-Transfer Printing (MTP): Introduction to micro-transfer printing/X-Celeprint, the benefits of MTP, and recent results. | Kevin Oswalt & Ron Cok X-Celeprint | 7:00-8:00pm | ||
| May 22, 2025 | Demo using CMC and Santec toolkits; Testing PIC components and devices such as CWDM and DWDM and ring resonators; Transmission and Back Reflection Measurements; Demo of packaged modules. | CMC | 6:30-8:30pm | Rogers Centre Gatineau Salon Level 2 |
Instructors
| Instructor/Presenter | Title/Affiliation |
| Amr Helmy | Professor ECE Department, University of Toronto |
| Alexander Janta-Polczynski | Senior Manufacturing Engineer IBM Bromont |
| Bruno Fisette | Research Scientist National Optics Institute (INO) |
| Kevin Oswalt | Engineer X-Celeprint |
| Ron Cok | Engineer X-Celeprint |
| Kasuya, Hideaki | Engineer Santec Corporation |
| Richard Eshaya | Engineer Santec Corportation |
| Snehel Sam Kunjumon | Engineer Santec Corporation |
| Ahmed Abumazwed | Staff Scientist, Photonics CMC Microsystems |
