SPARK Microsystems

Wireless Personal Area Network System-in-Package for Low-Energy, Low-Latency AI Wearables

Project

Existing short-range radio technology was not made to meet the high expectations of emerging wearables.

Enhanced by artificial intelligence (AI), wearable devices are evolving from accessories into always-on multimodal interfaces. They increasingly require ultra-low latency for natural, conversational AI, microsecond synchronization across multiple body-worn nodes, and all-day battery life in very small form factors.

Bluetooth/LE Audio and proprietary 2.4 GHz links struggle to guarantee deterministic latency and multi-node time alignment in congested spectrum, especially under continuous audio and sensor workloads. Wi-Fi offers throughput but is power-hungry and often too variable for bounded-latency personal-area audio/sensor streaming.

The SPARK Microsystems platform is architected to enable ultra-low-power, sub-millisecond wireless performance in edge-AI wearables such as smart glasses and wrist devices by synchronizing audio, sensor, and high-data-rate links. It combines hardware, firmware, compact antennas and a reference compute module in its next-generation ultra-wideband connectivity platform that accelerates always-on AI wearable development.

This project delivers a Canadian low-energy UWB SiP and deterministic PAN software stack purpose-built for synchronized audio/video and sensor streaming. It reduces integration risk by providing a drop-in connectivity subsystem design that OEMs can adopt quickly, with robust operation under interference and strict energy budgets.

C2MI’s Bromont, Quebec, facility will provide advanced microelectronics assembly, packaging, inspection, and reliability testing, enabling rapid iteration and validation of the company’s LE-UWB SiP prototypes.

Bittele Electronics in Toronto will provide its quick-turn local PCB manufacturing, assembly, and design for manufacturing expertise to help produce prototypes. SPARK will also leverage the expertise of Motsai in Brossard, Quebec, which offers hardware design, embedded firmware development, and sensor integration.

Building Canadian capacity

This project sits at the intersection of Edge-AI, advanced packaging, RFIC design and embedded software — all priority growth areas for Canada. It creates new domestic semiconductor and system IP, anchors high-value jobs and training in Quebec, strengthens packaging and reliability capability through C2MI, and enables small and medium-sized companies to participate in an export-driven value chain.

By establishing a Canadian-owned connectivity subsystem and secure networking stack, the project reduces dependence on foreign-controlled wireless IP for emerging AI wearables. Moreover, it improves resilience for domestic consumers, industrial and health applications.

“Support from the Government of Canada through FABrIC is an important accelerator for SPARK Microsystems as we bring our next-generation LE-UWB™ technology to emerging AI wearable Edge and Physical AI applications. This funding will help us move faster from semiconductor innovation to deployable wireless solutions, while strengthening Canada’s capacity in advanced microelectronics, packaging, and connected-device development. We are proud to contribute to a more resilient Canadian semiconductor ecosystem and to bring Canadian wireless innovation to high-growth global markets.”
— Fares Mubarak, Chief Executive Officer of SPARK Microsystems
SPARK Microsystems

SPARK Microsystems is building next-generation short-range wireless communication devices for consumer, industrial, and medical applications. Leveraging patented LE-UWB™ technology, SPARK delivers ultra-low-power, high-speed wireless connectivity with unmatched interference robustness and exceptionally low latency. LE-UWB™ technology is ideally suited for wearables, peripherals, tags, sensors, and other IoT-connected devices that require reliable, high-performance data communication, as well as ranging and positioning capabilities. SPARK makes it possible to minimize and ultimately eliminate wires and batteries across a wide range of emerging Physical AI and IoT applications.

Project Metrics

SPARK Microsystems

Project

Wireless Personal Area Network System-in-Package for Low-Energy, Low-Latency AI Wearables

Targeted Industry/ies

Digital Technologies, Medtech

Healthcare / Biotech, Digital Technologies (AI, 5/6G Data, etc.)

Type

Product Development

Awarded

May 2026

Location

Montréal

QC

Funding

$1,000,000

For more information on this project:

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