This is a two-day training on Low-temperature co-fired Ceramic (LTCC).

LTCC is a fabrication process that creates compact integrated systems of high-density electronic circuits and components. Involving ceramic materials that are co-fired at relatively low temperatures compared to traditional ceramics, this process allows various electronic components integration, such as resistors, capacitors, and inductors, into a single, multilayer ceramic substrate.

The key advantages of LTCC include high-frequency performance. With the increasing demand for high-frequency applications, traditional materials often struggle with signal integrity and loss. LTCC technology offers excellent high-frequency performance due to its low dielectric loss and stable dielectric properties, making it ideal for RF and mm-wave circuits.

Another crucial advantage is thermal management: Effective thermal management is important for high-power and high-density applications. LTCC materials exhibit superior thermal conductivity, which aids in dissipating heat efficiently, thereby enhancing the reliability and longevity of electronic components.

LTCC technology facilitates rapid prototyping and development cycles. This agility is beneficial for research and development activities where quick iterations and testing are necessary.