The design and development of MEMS devices hinge on three critical verticals: Multiphysics, Microfabrication, and System Integration. Seamless integration and effective communication between these verticals are essential for optimizing the design process and achieving successful product realization. These tools not only address the demands of emerging markets but also expand into diverse applications, including optics and photonics, in addition to silicon-based solutions.

In this webinar, we will explore how IntelliSuite facilitates each of these verticals and enhances the transitions between them, adding significant value to the design optimization process. The software empowers users to streamline and simulate fabrication processes before implementation, ensuring that designs are both manufacturable and high performing. By integrating fabrication models with Multiphysics FEM simulations, IntelliSuite enables the creation of devices optimized for both process feasibility and performance outcomes. Moreover, through reduced-order model simulation, IntelliSuite links seamlessly with circuit EDA tools, allowing system designers to precisely develop control and sensing circuits. Its open architecture further extends support to the design of non-silicon-based sensors and actuators, such as those using quartz, InP, GaAs, AlGaAs, metals/alloys, and sapphire. It also accommodates advanced process simulations, including angled ion beam etching (IBE), 3D lithography, 3D oxidation, and high-index substrate wet etching for materials like silicon and quartz.

Join us to learn how IntelliSuite bridges the gap between design and manufacturing, driving innovation in MEMS development beyond traditional boundaries.

Speaker Profile

Dr. Sripadaraja, the Manager of  Applications and Sales at IntelliSense Software, Lynnfield, MA (www.intellisense.com)  he is responsible for the development of business for MEMS software package IntelliSuite. He has about over 10  years of experience in design/fabrication and development of MEMS devices using IntelliSuite, he holds his Ph.D from National Institute of Technology, Karnataka, India.

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This presentation will cover the latest design of SwiftMote-Electrochemical, a wireless potentiostat.  

We plan on covering its position in the FABrIC program, what SwiftMote-Electrochemical v2 is, how you can make use of it, and most importantly, we are interested in obtaining your feedback – does the system have the features you need?  Would you like it manufactured?  What direction would you like to take the program in?  Are there other systems you are interested in FABrIC developing to support your research?  

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Join CMC as we host Livingston International’s Jeff Fraser for a discussion on how the current trade environment impacts Canadian imports and exports.  Gain insights on how the current environment affects compliance and costs as well as looking at mitigation strategies.  Learn how to better prepare for a new path forward.

Presenter: Jeff Fraser

As Director, Jeff leads a dedicated team of consultants in western Canada, focused on helping companies minimize risk and achieve higher levels of customs compliance in their international trade activities. He is based in Edmonton, Alberta. Jeff has over 30 years of experience in customs brokerage and compliance as well as in client service.  

Cortex-M55 is Arm’s most AI-capable Cortex-M processor and the first to feature Arm Helium technology.

It delivers the highest, most efficient ML and DSP performance for Cortex-M and also has inbuilt TrustZone security feature.

It simplifies AI implementation for IoT with the ease-of-use of Cortex-M, a single toolchain, optimized software libraries, and an industry-leading embedded ecosystem.

In this webinar you are about to be exposed to the Cortex-M55 architecture, capabilities and what makes it unique versus previous Cortex-M processors.

If you plan to enable classical ML and NN inference locally on your devices plus have security as well, then this webinar is suited for you.

As photonic integrated circuits (PICs) continue to revolutionize high-speed communications, the demand for reliable, high-frequency packaging and test solutions is increasing. In this webinar, we explore the intersection of RF design and photonic packaging, focusing on signal integrity considerations for testing PIC chips including high-speed modulators and photodetectors. We will discuss different packaging technologies and how to evaluate their impact on high-speed signals’ performance using circuit models and simulation tools. Finally, we will introduce standard PIC packaging solutions for RF evaluations.