As photonic integrated circuits (PICs) continue to revolutionize high-speed communications, the demand for reliable, high-frequency packaging and test solutions is increasing. In this webinar, we explore the intersection of RF design and photonic packaging, focusing on signal integrity considerations for testing PIC chips including high-speed modulators and photodetectors. We will discuss different packaging technologies and how to evaluate their impact on high-speed signals’ performance using circuit models and simulation tools. Finally, we will introduce standard PIC packaging solutions for RF evaluations.