Bandwidth requirements and energy constraints of data communications interconnects are pushing industry toward photonic integrated circuit (PIC) optical I/O solutions. This is reinforcing demand for scalable PIC platforms and packaging, but there is still no single material system that simultaneously provides efficient optical gain, high-performance electro-optic modulation, and ultra-low-loss passive routing.

Montréal-based Aeponyx Enterprises Inc. is tackling this problem with its hybrid photonic platform for advanced integrated optical components. The platform will reduce assembly complexity, coupling loss, footprint, and manufacturing cost while improving repeatability as well as thermal and RF performance.

Aeponyx’s project will develop a manufacturable hybrid photonic integration process that combines III-V active devices, Thin-Film Lithium Niobate (TFLN) modulators, isolators, and Silicon Nitride (SiN) passive circuitry on a unified photonic integrated circuit (PIC) platform.

Building on its existing SiN photonics platform and prior fabrication work with Canadian partners, Aeponyx will develop front-side cavity integration, self-alignment structures, and optical and electrical interconnect modules. Aeponyx will lead system architecture, PIC design, component selection, testing, and PDK definition; C2MI will provide access to SiN process recipes and support process-flow development and fabrication; and 3IT will provide access to e-beam lithography through a mix-and-match process with C2MI.

Aeponyx plans to move the process from TRL 4 to TRL 7. Short-loop tests will confirm key steps such as cavity etching, metallization, alignment, and coupling. Two full fabrication runs will enable end-to-end testing, process improvements, field-ready prototypes, and an early advanced PDK to support future products and wider ecosystem use.

The resulting platform will support applications in quantum technologies, communications, data centre interconnects, sensing, and instrumentation. Product readiness is targeted for mid-2028.