High-speed optical interconnects are essential to data centres, high-performance computing, and secure data communications infrastructure, but keeping pace with rising data traffic demands components that are faster, more efficient, and more reliable at scale. Current optical interconnect technologies struggle to deliver the channel density, power efficiency, and manufacturability needed as aggregate data rates climb into the terabit range.

Electro-absorption modulated laser (EML) arrays, which integrate multiple laser-modulator channels onto a single semiconductor chip, address these limitations by delivering high per-channel speeds in a scalable, cost-effective, multi-channel form factor. Today, no organization anywhere in the world has successfully demonstrated this class of device at the performance levels targeted by this project.

Inpho (ElectroPhotonic-IC Inc.) will define the system requirements, product specifications, and device optimization goals for a multi-channel array architecture that integrates several laser-modulator channels onto a single chip. This will improve manufacturing efficiency and scalability while enabling higher aggregate transmission speeds. Combining multiple channels on one chip makes it possible to generate and control several optical signals simultaneously, supporting per-channel speeds of 400 Gbps and beyond.

Inpho will also design the modulator elements within the array and ensure the final technology meets performance, manufacturability, and cost objectives. The National Research Council of Canada will contribute expertise in laser design, epitaxy, fabrication, and characterization. McGill University and the University of Ottawa will support the design and testing of III-V photonic chips. The project will leverage the Canadian Photonics Fabrication Centre (CPFC) as its core fabrication partner, securing semiconductor process and fabrication capability here in Canada. Together, the partners will develop the device architecture, fabrication processes, and testing methods needed for commercialization.

The project will produce a manufacturable EML array platform for next-generation optical engines and transceiver modules operating at 400 Gbps per channel and beyond.