Global supply chains need ultra-low-cost, item-level traceability and authentication that can meet emerging ESG, recyclability and extended producer-responsibility requirements, but conventional aluminum-and-silicon RFID inlays remain costly, resource-intensive and poorly aligned with sustainable packaging waste streams.

Quebec-based Meerv Inc. is addressing this problem with a roll-to-roll, multi-layer flexographic Sustainable Electronics Process Development Kit (PDK) using EcoCir conductive materials and programmable chipless RF structures that will enable converters to manufacture compostable, recyclable, silicon-free identity labels on existing packaging-grade press infrastructure.

The PDK will define material specifications, print settings, curing profiles, quality-control methods and RF benchmarks for chipless RF labels, sustainable RFID architectures and sensors used in packaging, logistics, authentication and industrial supply chains.

Meerv and co-lead Digitho Technologies Inc. are collaborating with the Institut des communications graphiques (I-CI) to validate the platform and accelerate compostable, recyclable printed RF electronics.

The partners will advance the technology from TRL 4–5 to TRL 7 by validating multi-layer printing and inline photomask processing on I-CI’s pre-commercial roll-to-roll press, testing registration, electrical performance, durability, substrate compatibility, establishing compostability and environmental stability.

The outcome will be a transferable PDK with material data sheets, design rules, manufacturing guidelines and performance benchmarks that reduce development time and support pilot-scale deployment by converters and downstream adopters.