A long‑standing problem in semiconductor and microfabrication: conventional spin coating wastes more than 90% of the photoresist used during deposition, which is a foundational step in nearly every microfabrication workflow. This inefficiency drives up material costs, increases hazardous waste, and limits the ability to scale advanced manufacturing processes.

Nanogrande is tackling this problem through the development of the ES‑400, a photoresist and thin‑film deposition platform based on its patented Fluidbed technology. Unlike spin coating, the Fluidbed process uses controlled fluid dynamics and physicochemical effects to organize material during deposition, enabling highly uniform films with less than 5% material loss. The project will advance the ES‑400 from Technology Readiness Level (TRL) 4–5 to TRL 7–8 through system integration, process optimization, and pilot‑scale validation.

Nanogrande will oversee system design, hardware integration, process engineering, IP management, and commercialization preparation. Co-lead ÉTS will contribute materials characterization, metrology development, benchmarking, and training of highly qualified personnel. C2MI will perform complementary characterization and metrology focused on MEMS applications, while LaCIME will support technical evaluation, pilot testing, and process‑integration activities relevant to semiconductor and advanced materials environments.

The outcome of the project will be a validated pilot‑scale deposition platform, three optimized photoresist formulations, demonstrated thickness uniformity, and reproducible performance across multiple wafers. The ES‑400 will be ready for pilot‑scale deployment and commercialization, enabling commercialization of equipment, consumables, and technical services.