Canadian industry and research institutes collaborate on eleven advanced fabrication projects with an estimated value of $14.8M
Ottawa: September 16, 2026: Augmenting Canada’s advanced semiconductor fabrication capacity is a strategic response to shifting technology and surging global demand — and a deliberate move to reinforce economic sovereignty and industrial resilience. The benefits extend beyond the domestic semiconductor sector itself, to the Canadian industries — from aerospace to defence, smart agriculture, transportation, medtech, and telecommunications — that rely on it to compete.
CMC Microsystems, which manages FABrIC, a Government of Canada Strategic Response Fund initiative to advance domestic capabilities in advanced semiconductor design and manufacturing, is pleased to announce an investment of over $5.9M, representing an estimated total value of $14.8M for eleven industry-research institute collaborations across Canada that leverage – and expand — domestic semiconductor fabrication capacity.
Launched in February 2026, this Challenge call drew on Canada’s research institutes’ world-class fabrication capabilities and the country’s formidable expertise in silicon photonics. Spanning foundational semiconductor technologies — photonics, MEMS, compound semiconductors and quantum — and advanced process technologies using materials like GaN, InP, and SiN that transcend the physical limitations of traditional silicon, the call generated 28 expressions of interest with wide-ranging end-use applications.
The semiconductor sector is one of the most complex and globalized industries in the world, with high-value nodes where specialized expertise can translate into economic power. Distinctly Canadian strengths — such as silicon photonics, which increasingly forms the backbone of the internet and AI datacentre ecosystem — and targeted fabrication expertise — can yield outsized results.
These are strategic investments that accelerate the development and commercialization of technologies and products where there is significant domestic capability and global opportunities.
The successful projects — seven in Quebec, three in Alberta, and one in Ontario — are:
Quebec: $3.9M in federal funding for a total investment of $9.7M
Aeponyx Enterprises Inc., Hybrid Photonic Platform for Advanced Integrated Optical Components, $960,281
Bandwidth and energy limits are pushing data systems toward optical I/O. Aeponyx’s hybrid photonic chip combines active and passive components on one platform, cutting complexity and boosting performance. The result is smaller, more efficient optical hardware for communications, sensing, and emerging quantum applications.
École de technologie supérieure (ÉTS), Flexible Hybrid Electronics Prototyping and Low-Volume Manufacturing Platform, $333,675
Flexible printed electronics remain difficult to build in Canada. A new local prototyping and manufacturing platform gives innovators faster, more secure access to wearable, biosensing, environmental, and smart‑packaging technologies. The capability reduces reliance on offshore suppliers and accelerates product development. The project co-lead is Seneca Sense Technologies Inc.
IPR Innovative Products Resources Inc., Fabrication and Packaging Process for Novel 3‑Axis MEMS Strain Sensor, $446,650
Accurate strain sensing is essential for safer infrastructure, but today’s sensors are fragile and limited. IPR’s manufacturable process for a compact, low‑power 3‑axis MEMS strain sensor will enable more reliable structural monitoring and strengthen domestic MEMS fabrication capability.
Meerv Inc., Sustainable Electronics Process Development Kit, $637,600
Global supply chains need low‑cost, traceable, and sustainable electronic tags. A silicon‑free, compostable RF process kit enables recyclable sensors using existing printing tools. The approach strengthens circular‑economy goals and supports greener item‑level tracking. The project co-lead is Digitho.
Nanogrande Inc., High‑Efficiency Fluidbed Photoresist Deposition Platform, $598,700
Conventional spin coating wastes most of the photoresist used in chip fabrication. Fluidbed deposition cuts waste dramatically while improving coating uniformity. The method lowers material costs and supports more sustainable semiconductor manufacturing. The project co-lead is École de technologie supérieure (ÉTS).
Noze Inc., Scalable MEMS Chemical Sensor Array Development for Health Monitoring, $405,082
Breath-based health monitoring relies on high-precision, highly reliable MEMS chemical sensor arrays. By scaling MEMS fabrication through controlled, repeatable processes, this technology supports pilot-level production and enables non-invasive, real-time health insights for clinical and consumer applications.
OSCPS Motion Sensing Inc., Refined Fabrication Process Development for Low‑Loss Photonic Gyroscope Sensor Microchips, $486,000
Accurate motion sensing is essential when GPS and satellite signals are unreliable. OSCP and C2MI are refining the fabrication of compact photonic gyroscope chips to reduce optical losses and improve manufacturing consistency. The project will support commercialization and strengthen Canadian silicon photonics capabilities.
Alberta: $1.1M in federal funding for a total investment of $2.7M
Applied Nanotools Inc., Si–SiN Platform for Quantum Photonic Circuit Prototyping, $210,548
Photonic integrated circuits for quantum applications require ultra-low loss routing and broad wavelength coverage. A monolithic silicon–silicon nitride platform enables both active and passive functions on a single chip. The approach makes prototyping more accessible for quantum technologies, LiDAR, sensing, and advanced communications.
Norcada Inc., Advanced Fabrication Processes for Next‑Generation Semiconductor Hybrid Biosensing, $266,800
Advanced biosensors rely on ultra‑thin, stable membranes that are difficult to produce at scale. Refined fabrication techniques enable hybrid semiconductor biosensing chips using thin membranes and 2D materials. The result is better tools for DNA analysis, diagnostics, environmental monitoring, and neuromorphic computing. The project will be managed with technical collaboration from the University of Ottawa.
TransEON Inc., Commercial Scaling of Domestic GaN MOS RF Foundry Processes, $625,137
Next‑generation Radio Frequency (RF) systems need chips that handle higher power and frequency. Scaled gallium‑nitride RF processes enable domestic production of high‑performance RF devices. This capability strengthens Canada’s position in communications, radar, satellite systems, and future 6G hardware.
Ontario: $0.9M in federal funding for a total investment of $2.4M
Inpho (ElectroPhotonic‑IC Inc.), Monolithically Integrated EML arrays for DR and FR applications, $940,778
High‑speed optical links are essential for modern data centres and secure networks. A single‑chip laser‑modulator design supports very high data rates with lower power use. The technology enables faster, more efficient optical engines for next‑generation communications.
More information on funded projects can be found here.
FABrIC: A generational investment by the Government of Canada
FABrIC is a Strategic Response Fund initiative of the Government of Canada to expedite domestic capabilities in advanced semiconductor design and manufacturing. Managed by CMC Microsystems, FABrIC galvanizes national strengths in photonics, MEMS, compound semiconductors and quantum technologies, accelerating commercialization and amplifying Canada’s competitive advantages and the economic impact of its semiconductor sector.
Contact Infortmation
Gordon Harling
President & CEO
CMC Microsystems
(613) 449 6820
harling@cmc.ca
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